Against the backdrop of the global semiconductor industry actively exploring post Moore era innovation paths, carbon nanotubes provide the most likely disruptive solutions for the post Moore era with their advantages of ultra-high carrier mobility, advanced structural adaptability, and ideal CMOS characteristics.

As the first high-tech enterprise in China to focus on the research and development, engineering, and industrialization of carbon nanotube crystal circles, Carbon Semiconductor recently announced the completion of a new round of financing. This round of financing has not only received continuous support from existing shareholders, but also successfully introduced multiple partners with deep industrial backgrounds and strategic resources, aiming to jointly inject key impetus for technology to move from laboratories to large-scale applications, and promote efficient aggregation of industrial resources.

Strategic synergy: Building an open system and tackling core issues

With the development of semiconductor technology entering a new stage, the industrialization of carbon nanotubes is entering a critical window period. The financing of Enjing Semiconductor this time is a proactive response to industry trends. The newly introduced partners come from key links in the industrial chain, and their strategic capital injection not only reflects the high recognition of the industrial ecosystem for the carbon based technology path and the company's development potential, but also demonstrates the common willingness of all parties to seize historical opportunities through deep collaboration.

Based on a clear industry consensus, the key to the industrialization of carbon nanotube technology has shifted from a single technological breakthrough to filling two major gaps in the system: "stable supply of high-quality materials at the wafer level" and "development of carbon nanotube CMOS processes compatible with semiconductor production lines (Fab)". To this end, Enjing Semiconductor will be the first to complete the pilot test of 8-inch carbon nanotube crystal circles in 2025, achieving a key leap from laboratory to engineering. To move towards comprehensive industrialization, the development and mass production of 12 inch wafers compatible with mainstream production lines is a necessary path, which is seen as a "passport" to access the global manufacturing system. At present, with the support of shareholders and strategic partners, the company's carbon nanotube crystal round process validation line has been successfully connected, laying a solid foundation for subsequent research and development.

Therefore, in the face of the complex systemic engineering mentioned above, a single breakthrough is no longer sufficient to cope. Only by building an open and collaborative tackling system and aggregating industrial strength can we effectively break through bottlenecks. The capital and industrial resources gathered in this round of financing will be precisely invested in tackling the two core propositions of "wafer mass production" and "CMOS process integration". Enjing Semiconductor will work together with all shareholders and strategic partners, using this system as a framework, to promote the close connection of the entire chain from research and development, manufacturing, design to market, and jointly transform technological milestones into solid industrial foundations.

Global Racing: Anchoring Proven Disruptive Applications

The value of technology is defined by the market. The disruptive application of carbon nanotubes is no longer a distant prospect, but an industry reality being verified by top global institutions, which constitutes a clear market attraction:

United States: System architecture innovation, CNT-CMOS 3D-IC heterogeneous chips have achieved chip verification, focusing on system level innovations such as CNT-CMOS 3D-IC heterogeneous chips and single-chip 3D integration, aiming to break through computational bottlenecks. Relevant designs have been successfully chip printed on commercial production lines, taking the lead in crossing the key threshold from design to manufacturing.

Europe: Featured Devices Passed Authoritative Reliability Certification

Deeply cultivating characteristic fields such as carbon based passive devices (capacitors), photonic integrated chips (PIC), sensors, EUV films, etc., its key components such as carbon based capacitors have passed strict reliability testing in November 2025 and are rapidly moving from laboratory research and development to commercial introduction.

Japan and South Korea: Terminal products have been released with clear mass production schedule

Focusing on high-end manufacturing and core components, relying on vertical integration capabilities, Japanese giants have released uncooled infrared image sensors with performance exceeding traditional technology by more than three times, and plan to launch them in North America in 2026.

The above progress collectively points to the unique advantages of carbon nanotubes in advanced computing chips, distinctive discrete devices, and optoelectronic sensing. Based on this, China can not only rely on validated technological routes to quickly enter, but also leverage global leading material advantages and market depth to accelerate the transition from parallel to leading industries.

Product planning: Focus on three major directions and accelerate the landing of technology

Based on this round of financing, Enjing will focus on three major directions with industry partners, and transform consensus and paths into concrete results:

● Consolidate the foundation and expand production capacity: Continuously optimize the 8-inch carbon nanotube round process, focus on improving product yield, stability, and production capacity, and meet the growing application needs of downstream customers.

● Achieving milestones and connecting manufacturing: We will fully promote the research and production line verification of 12 inch carbon nanotube crystal circles, laying the foundation for the industry to cross the manufacturing threshold and achieve large-scale applications.

● Open ecology, accelerate application: Focus on cutting-edge scenarios such as low rail communication and 3D computing chips, carry out in-depth joint development and technology verification, and transform material advantages into product competitiveness.

Grateful colleagues: working together to embark on the 'chip' journey

We would like to express our sincere gratitude to all shareholders for their long-term trust and steadfast support. We sincerely thank all shareholders for their crucial support and valuable contributions throughout the company's development process. At the same time, we warmly welcome the addition of new partners and cherish the industry vision and resources they bring. We look forward to working together with all shareholders to consolidate capital, technology, and market insights into a common industrial mission, accelerate the large-scale application of carbon based semiconductor innovation technology, and jointly build an open and collaborative innovation ecosystem.

From blueprint to reality, based on industrialization practice, Enjing has systematically sorted out the technological path, real challenges, and commercial prospects of carbon nanotubes into the"White Paper on Industrialization of Carbon nanotube Wafers" (the report has been officially released in the article "Where is the Road in the Post Moore Era?White Paper on Industrialization of Carbon Nanotube Rounds released today)! 》Presented to you in the middle). It is not only a detailed technical and industrial roadmap, but also the first in-depth footnote we have submitted. We cordially invite you to review this future oriented industry report and explore the "chip" future of the post Moore era together.