Global
+86 512 6258 0966
+86 180 0621 8012
+86 180 0621 8012
Translating material potential into product advancement
Tackling the "Power Wall" challenge driven by the surge in chip compute, we utilize carbon nanotubes to construct three-dimensional vertical energy storage structures, moving on-chip capacitors from planar layouts to 3D architectures, aiming to provide high-density, fast-response power delivery solutions for HPC and AI chips.
Soaring Power DensityThe three-dimensional structure offers orders-of-magnitude improvement potential in energy storage capacity per unit area.
Instantaneous Power ResponseA low-impedance design enables precise delivery of nanosecond-scale transient high power.
Advanced Process CompatibilityThe solution is compatible with mainstream CMOS processes, establishing feasibility for integration as a high-performance IP block.
5G/6G base station RF front-ends (filter tuning, antenna switch decoupling); High-speed optical modules / CPO (laser driver power supply decoupling, TIA bias stabilization)
Near-chip decoupling for AI/GPU chips, reducing PDN impedance and enhancing compute stability
Automotive 77GHz radar, miniaturization of smart cockpit communication modules, and highly reliable power management
Demands for highly reliable, long-lifetime, and ultra-miniaturized capacitors in implantable devices
Carbon nanotube crystal round technology challenge, one click docking professional solution.
Tel:+86 512 6258 0966
Tel:+86 180 0621 8012
E-mail:service@cs-tec.com.cn
Address:Building 23, No. 75 Putian Road, Suzhou Industrial Park, Jiangsu Province, China
